FORWARD FW-S500 500×350mm Heat-Resistant Insulation Silicone Pad for Mobile Phone BGA Soldering

FORWARD FW-S500 Heat-Resistant Silicone Soldering Mat

The FORWARD FW-S500 Silicone Pad provides a large, protective work surface for mobile phone motherboard repair, BGA soldering and electronics servicing. Measuring 500 × 350mm, it offers ample space for arranging components and repair tools while helping protect the desktop from heat during soldering work.

Key Features

• Heat Resistance up to 500°C: Designed to withstand high temperatures from hot air guns, soldering irons, soldering stations and other repair equipment.
• Protective Work Surface: Helps protect the desktop from heat during mobile phone repair and soldering operations.
• Large Multi-Section Work Area: Provides a spacious surface with multiple sections for organizing tools and small components.
• Flexible and Resilient: Strong, flexible construction allows the pad to be curled or twisted for convenient storage while retaining its shape.
• Waterproof and Stain-Resistant: Helps resist water and stains, making the surface easier to maintain and clean.
• Easy Workshop Maintenance: Helps keep the repair workspace cleaner and more organized.

Specifications

• Brand: FORWARD
• Model: FW-S500
• Product Type: Heat-Resistant Silicone Pad
• Size: 500 × 350mm
• Heat Resistance: Up to 500°C
• Properties: Flexible, Waterproof and Stain-Resistant
• Application: Mobile Phone Repair, BGA Soldering and Electronics Work

Package Includes

• 1 × FORWARD FW-S500 Silicone Pad